Lub 1+N+1 HDI PCB architecture koom ua ke laser-drilled microvias ntawm cov txheej txheem sab nraud txuas rau hauv nruab nrab ntau- txheej txheej (N), ua tiav cov khoom siv siab ntom ntom thiab nplua- kab routing muaj peev xwm tshaj li tus qauv dhau los ntawm - qhov txwv. Qhov kev teeb tsa no ua kom haum zoo -pitch BGAs mus rau 0.4 mm suab thaum khaws cia lub zog sab hauv thiab cov dav hlau hauv av. Fabrication siv laser direct imaging (LDI), tswj- qhov tob laser drilling, thiab cov txheej txheem lamination ua ntu zus kom haum rau siab -cov teeb liab ntom ntom, ua raws li RoHS thiab REACH ib puag ncig cov lus qhia.
Technical Specifications
|
Parameter |
Specification txwv |
|
Txheej suav |
3 mus rau 12 txheej (1+N+1 pawg-up) |
|
Min. Txoj kab dav / qhov sib nrug |
3.0 / 3.0 mil (0.075 hli / 0.075 hli) |
|
Min. Laser Microvia Diameter |
4 mil (0.1 hli) |
|
Board Thickness Ntau |
0.6 hli - 2.4 hli |
|
Aspect Ratio (MicroVia) |
Mus txog 1: 1 |
|
Aspect Ratio (Los ntawm -Qhov) |
Mus txog 12: 1 |
|
Core Material Options |
FR-4 (Tg 170℃/ 180 degree), Siab -Frequency (Rogers, Taconic), Tsawg-Poob (Panasonic Megtron 6/7) |
|
Nto tiav |
ENIG, Immersion Silver, OSP, HASL (Lead{0}}Free), ENEPIG |
|
Solder Mask Xim |
Ntsuab, Dub, Xiav, Liab, Dawb, Daj (Matte / Glossy muaj) |
|
Impedance Control kam rau ua |
± 10% tus qauv (± 5% muaj nyob ntawm qhov kev thov) |
Cov yam ntxwv tseem ceeb
Sequential Lamination Processing:Tshem tawm cov cuab yeej laum stub resonance los ntawm stacking laser microvias ncaj qha hla faus vias (stacked-ntawm thev naus laus zis).
Zoo-Pitch BGA Routing:Txhawb kev tivthaiv pitches mus rau 0.4 hli yam tsis muaj kev txi lub zog xa dav hlau kev ncaj ncees.
Tswj Dielectric Spacing:Tuav qhov kev ncua deb ntawm cov dav hlau siv thiab cov teeb liab kab los cuam tshuam electromagnetic cuam tshuam (EMI).
Siab -Tg Khoom Substrates:Nrog rau ntau qhov kev mus ncig ua si thaum lub sijhawm ua cov hlau lead-dawb sib dhos reflow profiles mus txog 260℃.
Daim ntawv thov
5G Infrastructure
Cov kav hlau txais xov nquag (AAU) thiab cov xov tooj cua hauv xov tooj cua uas xav tau siab -ntau zaus teeb liab routing.
Automotive Electronics
Advanced Driver Assistance Systems (ADAS) radar modules thiab lub koob yees duab tswj units.
Kev Lag Luam Kev Lag Luam
High -cov ntaub ntawv tau txais cov ntaub ntawv ceev thiab cov txheej txheem sib xyaw ua ke.
Khoom siv kho mob
Ultrasound imaging probes thiab portable diagnostic monitors yuav tsum tau compact footprints.
Kev kho kom haum
Stack-Up Engineering:Kev tshuaj xyuas engineering ntawm cov neeg siv khoom Gerber thiab pawg-cov lus pom zoo los txhim kho impedance thiab txo cov txheej txheem.
Kev hloov khoom siv:Hla - xa mus rau lwm cov ntaub ntawv laminate (piv txwv li, Isola, Shengyi) kom tau raws li lub hom phiaj tus nqi thiab dielectric tas li (Dk).
Plugged Via Options:Resin plugging (IPC-4761 Hom VII) thiab tooj liab plating hla cov hlaws rau cov ntaub qhwv - hauv-ntawm daim ntawv thov.
Profileing Tolerances:Routing, V- qhab nia, thiab laser routing tailored rau complex chassis enclosures.
Kev Tswj Xyuas Zoo
Automated Optical Inspection (AOI):100% kev tshuaj xyuas cov txheej txheem sab hauv thiab sab nrauv rau etch tsis xws luag, luv, thiab qhib.
Automated X-Ray Inspection (AXI):Txheeb xyuas qhov sib npaug thiab qhov tsis muaj feem pua hauv cov txheej txheem microvia stacked.
Flying Probe Testing:Kev ntsuas hluav taws xob txuas ntxiv thiab kev sib cais ua tiav ntawm 100% ntawm cov khoom tsim ua ntej xa khoom xa tuaj.
Microsection Analysis:Kev tshuaj xyuas lub cev puas tsuaj tau ua ib qho los txheeb xyuas tooj liab plating thickness, dielectric thickness, thiab chim tawg tsis kam.
Manufacturing & Certifications
Cov Khoom Siv Hauv Tsev:Nruab nrog Orbotech LDI systems, Hitachi siab - ceev CNC drilling tshuab, Schmoll laser ntawm kev xyaum, thiab tsis siv neeg lub tshuab nqus tsev lamination presses.
Txheej Txheem Muaj Peev Xwm:Cleanroom chav kawm 10,000 ib puag ncig rau kev ua yeeb yaj kiab qhuav thiab daim ntawv thov daim npog ntsej muag.
Kev Ua Raws Cai:Ua tau raws li IPC-A-600 Chav Kawm 2/3 thiab IPC-6012 tus qauv, ua tau raws li RoHS thoob ntiaj teb thiab REACH cov cai.
System Certifications:ISO 9001: 2015, IATF 16949 (Automotive), ISO 13485 (Cov Khoom Siv Kho Mob), thiab UL tau ntawv pov thawj (E-number tracking available on request).
Ntim & Xa
Ntim Cov Lus Qhia
Lub tshuab nqus tsev vacuum- kaw ESD- lub hnab ntim cov khoom muaj kev nyab xeeb uas muaj silica gel thiab cov cim qhia cov av noo (HIC), ntim rau hauv ob npaug - phab ntsa corrugated cartons.
Logistics Partners
Kev nthuav dav huab cua thauj khoom ntawm DHL, FedEx, thiab UPS rau cov qauv; palletized dej hiav txwv los yog huab cua freight rau ntim ntau lawm batch.
Lub Sijhawm Lead & Scaling
Prototypes (1+N+1):5 - 7 hnub ua hauj lwm nrog optimized vaj huam sib luag siv kom sai - tig validation.
Volume Production:12 - 18 hnub ua hauj lwm, featuring tooling txuas ntxiv mus xyuas kom seamless scaling los ntawm prototype batch rau pawg- ntau lawm kab.
FAQ
Q: Dab tsi yog qhov qhov muag tsis pom qhov tsawg kawg nkaus ntawm qhov loj me uas txhawb nqa hauv 1+N+1 kev teeb tsa?
A: Tus qauv tsim muaj peev xwm txhawb nqa qhov tsawg kawg nkaus laser -drilled microvia txoj kab uas hla ntawm 4 mil (0.1 mm) nrog rau lub hom phiaj ntes pad loj ntawm 10 mil.
Q: Koj puas tuaj yeem ua cov neeg siv khoom- qhia txog impedance xam?
A: Engineering ua qhov kev tshuaj xyuas DFM siv Polar Instruments SI8000/9000 software raws li koj qhov dielectric tsis tu ncua thiab kab geometry ua ntej tsim tawm.
Q: Dab tsi yog qhov siab tshaj plaws tooj liab thickness ua tiav ntawm microvia txheej?
A: Cov txheej txheem txheej txheem txhawb nqa 1 oz tiav tooj liab tom qab plating, nrog 0.5 oz thiab 2 oz kev xaiv muaj raws li kab / qhov chaw txwv.
Q: Koj yuav ua li cas thiaj li ua tau pawg- ntawm kev ntseeg tau thaum lub sij hawm thermal shock?
A: Kev tswj cov tooj liab plating tsis tuaj yeem sau cov microvias tag nrho, thiab cov khoom siv roj hmab yog siv rau qhov chaw tiaj tus pad - hauv - ntawm qhov chaw yuav tsum tau tiv thaiv kom tsis txhob muaj dimpling thiab solder voids.
Q: Cov ntaub ntawv twg yog muab rau txhua qhov kev xa khoom xa tuaj?
A: Txhua batch suav nrog Daim Ntawv Pov Thawj Ua Raws Cai (CoC), cov ntaub ntawv xeem microsection, cov ntaub ntawv pov thawj hluav taws xob, thiab cov ntaub ntawv pov thawj kev lees paub lees paub RoHS thiab REACH ua raws.
Q: Cov ntaub ntawv dab tsi yuav tsum tau pib ua DFM kuaj?
A: Gerber RS-274X lossis ODB++ cov ntaub ntawv nrog rau IPC-D-356 netlist thiab kev tsim cov duab kos qhia qhov yuav tsum tau ua pawg.
Thov ib daim Quote
Xa cov ntaub ntawv Gerber, pawg- raws li qhov yuav tsum tau ua, thiab kwv yees qhov ntim txhua xyoo kom tau txais DFM tshuaj xyuas thiab cov lus hais hauv 24 teev.
Email:sales@Ldtac.com
Upload Portal:Ruaj ntseg DFM File Transfer Link
Cim npe nrov: 1+n+1 hdi pcb, Tuam Tshoj 1+n+1 hdi pcb manufacturers, lwm tus neeg, Hoobkas
