Heavy Copper PCBs

Qeb khoom

Cov Khoom Kawg

Tiv tauj peb

TEL:+8618948705000
Email:sales@Ldtac.com
Ntxiv: 5th pem teb, Tsev 1, Jinshan Industrial Park, 375, Xixiang Section, Guangshen Road, Xixiang Street, Baoan District, Shenzhen City, Guangdong Province, Suav teb

Heavy Copper PCBs (3 oz - 20+ oz)

Siab -Kev faib hluav taws xob tam sim no & Thermal Integration Printed Circuit Boards

Hnyav tooj liab PCBs suav nrog cov hnyav tooj liab los ntawm 3 oz (105 um) mus rau 20+ oz (700 um) ib txheej, laminated nyob rau hauv ntau- txheej lossis ib zaug / ob npaug - sab architectures. Engineered rau siab nruam siab -tam sim no lub zog routing (50A{11}}400A+) thiab ncaj qha thermal rho tawm los ntawm high-power MOSFETs / IGBTs / SIC modules tsis muaj sab nraud busbars.

Core Capability Hnab:1 mus rau 12 khaubncaws sab nraud povtseg (hnyav fais fab dav hlau sib xyaw nrog nplua -pitch teeb liab / tswj txheej); txheej txheej hnyav tooj liab mus txog 15 oz, sab hauv txheej mus txog 20 oz.

Primary Differentiator:Cov tswv cuab sib txawv ntub dej-etch them nyiaj thiab ntau-theem theem-plating profiles suppressing tooj liab thickness gradient variation hla loj- hom ntawv muaj vaj huam sib luag (500 x 600 mm).

Ultra{0}}Hnyav tooj liab PCB

Ntxiv rau Kev Nug
8 Oz Heavy Copper PCB

Ntxiv rau Kev Nug
6 Oz Heavy Copper PCB

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4 Oz Heavy Copper PCB

Ntxiv rau Kev Nug
3 Oz Heavy Copper PCB

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2 Oz Heavy Copper PCB

Ntxiv rau Kev Nug

Technical Specifications

Parameter	Muaj peev xwm / Ntau	Kev Sau Ntawv Sau / txwv
Copper Luj (Tiav)	Sab nraud: 3 oz - 15 oz Sab hauv: 3 oz - 20 oz	Mixed stackups (piv txwv li, 10 oz fais fab + 1 oz tswj) txaus siab
Min. Track / Gap (>= 4 oz)	Track: 6 mil - 10 mil Gap: 8 mil - 12 mil	Nplai nrog qhov hnyav tooj liab tiav; etching factor tswj
Max Board Dimension	500 x 600 mm	Kev siv vaj huam sib luag cuam tshuam rau vaj huam sib luag- ntug tooj liab thinning
Txheej suav	1 mus rau 12 txheej	Sab hauv- txheej hnyav tooj liab yuav tsum hnyav resin-cov ntsiab lus prepreg (7628 / 2113 mix)
Cov khoom siv substrate	High-Tg FR-4 (Tg >= 170 deg C), CEM-3, Ceramic-filled hydrocarbon (Rogers RO4003C / TC series)	Mandatory peel-strength verification >= 1.2 N/mm
Nto tiav	ENIG, ENEPIG, Immersion Silver, OSP, HASL (Lead{0}}free)	ENIG nyiam rau hnyav- tooj liab- kev sib txuas / lub zog- cov khoom siv sib tiv tauj
Thermal Vias / Inlays	Khoom tooj liab puv / capped ntsaws vias, nias- haum qhov	Tsis muaj dab tsi -X pub dawb- txoj kev lees txais kab hluav taws xob ib qho IPC-A-600 Chav Kawm 3

Ntsiab nta

Zero-Busbar Hybrid Integration

Consolidates tooj liab busbars ncaj qha rau hauv FR4/ceramic stackups, txo cov neeg kho tshuab fastener suav los ntawm 60% thiab tshem tawm kev co -loosened ntsia hlau terminals.

Tswj Etching Sidewall Profile

Trapezoidal kaum sab xis<= 15 deg maintained on >= 6 oz lem, tiv thaiv lub npog ntsej muag bridging thaum huab hwm coj -reflow ntawm QFN/TO-247 pob.

Thermal -Gradient Mitigation

High-resin-flow prepreg sequence puv qhov sib sib zog nqus interstitial voids ntawm tuab tooj liab dav hlau, tshem tawm micro-voids nquag nqus dej los yog siab -voltage tracking.

Siab -Tam sim no Thermal Spreading

Thermal resistance (R_thetaJC) txo ntawm 35% piv rau tus qauv 1-oz boards nrog thermal ntawm arrays.

Daim ntawv thov

EV/HEV Inverters:DC- txuas capacitor interface thiab 3-theem choj rooj vag- tsav tsheb / lub zog-theem kev sib koom ua ke.

Industrial Tsav Tsav (VFDs):480V-690V high-tam sim no tso zis theem nqa 150A ntu ntu tam sim no.

Renewable Energy Infrastructure:Hnub ci txoj hlua inverter DC combining nodes thiab cua-turbine suab- tswj cov tsav tsheb tsav.

High-Power Vuam & Plasma Cutters:Siab - zaus hloov pauv hloov windings thiab siab - tam sim no rectifier txuas hniav.

Customization & Engineering Waiver Scope

Stackup Engineering Review:Xa Gerbers + xav tau txuas ntxiv / nce siab tam sim no cov ntaub ntawv (I_rms, I_peak) rau tooj liab - qhov hnyav optimization.

DFM Violation Redlining: If DFM audit flags copper/space violation on >= 6 oz, peb pab pawg AE muab cov lus qhia rov qab Gerber nrog 3 qhov kev hloov pauv hauv 16 teev.

Local Copper Thickening (Xaiv Plating / Kauj Ruam Plating):Hnyav tooj liab txwv rau siab - thaj tsam tam sim no; txheem 1 oz-2 oz khaws cia hauv cov cheeb tsam zoo IC breakout.

Cavity & Qhov tob Milling:Tswj tau - qhov tob milling rau ncaj qha semiconductor tuag- txuas lossis busbar lub davhlau ya nyob twg hnab ris.

Prototypes Modification Turnaround:Tus qauv tsim 10-12 hnub ua haujlwm tom qab-DFM kos npe tawm.

Kev Tswjhwm Zoo & Kev Ntsuam Xyuas Cov Qauv

Khoom siv Traceability

Cov Khoom Siv Certificate of Conformance (CoC) + Laminate Lot Manufacturer Batch ID muab cov qauv nrog cov khoom xa tuaj, txhawb nqa tag nrho IPC -1791 / supply-chain traceability ntawm kev thov.

Ua raws li IPC

Tsim los ntawm IPC-6012 Chav Kawm 3 / Chav Kawm 3 / A (High Reliability / Automotive qhov chaw).

Txheej Txheem Tshawb Xyuas Rooj vag

X-Ray Fluorescence (XRF):Nickel / Kub los yog Nto tiav thickness pov thawj ib batch.
AOI + Automated Laser Profilometry:Copper thickness thiab deg planarity daim ntawv qhia post -etch.
Microsection Analysis (Kev puas tsuaj): Plated-through-hole copper barrel wall thickness (>= 25 um min hauv zos), kev ntsuas cua sov (288 deg C solder ntab 10 vib nas this x 3 cycles) ib IPC-TM-650 2.6.8.
Siab-Qhov Muaj Peev Xwm (Hi-Pot) Dielectric Withstand:Kuaj ib tus qauv tsim voltage profile (piv txwv li, 2.5 kVAC / 60s rau kev sib cais qhov sib txawv).

Manufacturing & Facility Baseline

Etching Kab

Kab rov tav siab -pressure conveyor spray etch nrog tiag -lub sij hawm cupric chloride / ferric chloride regeneration thiab ceev / kub kaw- lub voj kev tawm tswv yim.

Plating

Direct DC / Pulse thim rov qab lub sijhawm plating kab nrog rau siab siab - yam -pulse rectification rau cov khoom sib xws hauv cov khoom hnyav - tooj liab PTH.

Cov ntawv pov thawj

ISO 9001: 2015, IATF 16949: 2016 (Automotive quality management system), ISO 13485 (optional/medical power), UL-listed (E-file tracking active).

Ntim & Xa

Humidity Control

Lub tshuab nqus tsev- kaw los tiv thaiv- lub hnab ESD zoo li qub nrog 30% -40% RH silica gel desiccant thiab humidity indicator card (HIC).

Kev tiv thaiv lub cev

Interleaved EPE ua npuas ncauj ntawv; ntug-board cardboard kaum protectors; kev cai hnyav- lub luag haujlwm export thawv lossis fumigated ntoo pallet.

Traceability Labeling

Barcoded yob / thawv ntawv teev hnub Code, Batch / Lot ID, Copper Weight Class, thiab UL Logo.

Cov ntsiab lus shipping

FOB Shenzhen / CIF European & North American lub ntsiab chaw nres nkoj ntawm huab cua freight (DHL / FedEx nthuav qhia rau prototypes, DHL / UPS los yog cua charter rau ntim) los yog hiav txwv freight thawv.

FAQ

Q: Dab tsi yog qhov siab tshaj plaws tooj liab qhov hnyav rau cov khaubncaws sab nraud povtseg hauv 6-txheej board?

A: 10 oz ib txheej sab hauv yog tus qauv txwv; 15 oz-20 oz yuav tsum tau tshwj xeeb siab- resin buildup prepreg (xws li, 2 x 7628 high-flow resin systems) los tiv thaiv resin starvation thiab lamination voids.

Q: Koj ua li cas tiv thaiv tooj liab tev / delamination thaum cov hlau lead-dawb solder reflow (260 deg C ncov)?

A: We enforce multi-stage oxide/black oxide alternative chemical micro-roughing (Bondbond/CZ treatment) yielding peel strength >= 1.4 N/mm, txheeb xyuas los ntawm kev kuaj xyuas daim coupon kev nyuaj siab rau ib qho.

Q: Koj puas tuaj yeem sib xyaw 10 oz fais fab zones nrog 0.5 oz BGA suab ntawm tib txheej?

A: Tsis muaj nyob rau tib lub hom phiaj hlau ncuav; peb siv cov kauj ruam-plating los yog ntau- cheeb tsam tooj liab faib qhov twg zoo -pitch breakouts hloov ntawm stitched thermal/signal vias mus rau hnyav tooj liab fais fab dav hlau.

Q: Yuav ua li cas yog tias peb cov Gerber tuaj yeem ua txhaum min- taug qab txoj cai ntawm cov tooj liab hnyav?

A: AE chij ua txhaum cai nyob rau hauv 16 teev nrog redlined lwm stackups thiab tooj liab - hnyav redistribution xaiv.

Q: Hom ntawv pob twg yuav tsum muaj rau DFM audit?

A: Gerber RS -274X lossis ODB++, ua tiav daim duab sib dhos nrog cov nqi dielectric tas li (Dk), thiab cov ntaub ntawv laum nrog cov ntsiab lus ntawm cov plated / non-plated slots.

Q: Kev lav phib xaub thiab kev lav phib xaub li cas - zam kev daws yog tias siab - tam sim no thermal runaway tshwm sim vim qhov sib txawv ntawm pawg thawj coj saib?

A: Tag nrho cov tsim ua yuav tsum tau ua tus neeg siv khoom DFM kos npe -tawm. Kev ua raws li kev lav phib xaub yog tswj hwm los ntawm tus qauv IPC-6012 Chav Kawm 3 qhov kev lees paub; Kev sib koom ua haujlwm tsis ua haujlwm (8D tsab ntawv ceeb toom) txhawb nqa hauv 5 hnub ua haujlwm ntawm kev rov qab los.

Thov Ib Daim Ntawv Tso Cai (RFQ Xa Daim Ntawv Teev Npe)

Txhawm rau kaw hauv DFM tshuaj xyuas thiab hais lus hauv 24 teev ua haujlwm, muab:
Gerber / ODB++ Pob + Laum cov ntaub ntawv + Stackup txheej specification.
Copper Nyhav Lub Hom Phiaj:Outer/Inner oz ib txheej.
Volume Profile:Prototype quantity + Kwv yees txhua xyoo ntim (EAV) lossis daim pam tso tawm sijhawm.
Kev Ua Raws Cai / Txuj Ci:IPC Chav Kawm 3, IATF 16949 PPAP Theem 3 cov ntaub ntawv xav tau (Yog / Tsis yog) / FAI pob scope.
Target Delivery Port / Destination Zip Code.

Nrog kev paub dhau los, peb yog ib qho ntawm cov kws tshaj lij hnyav tooj liab pcbs tuam ntxhab thiab cov muag khoom hauv Suav teb. Peb sov siab txais tos koj mus yuav cov khoom zoo siab hnyav tooj liab pcbs muag ntawm no los ntawm peb lub hoobkas. Yog tias koj muaj lus nug txog kev koom tes, thov koj xav email rau peb.