High Tg PCBs

Qeb khoom

Cov Khoom Kawg

Tiv tauj peb

TEL:+8618948705000
Email:sales@Ldtac.com
Ntxiv: 5th pem teb, Tsev 1, Jinshan Industrial Park, 375, Xixiang Section, Guangshen Road, Xixiang Street, Baoan District, Shenzhen City, Guangdong Province, Suav teb

High Tg Printed Circuit Boards (Tg >= 170℃- 210 degree)

Engineering-qib thermal kuj rau siab-load, ntau-reflow fais fab thiab muaj khoom kho vajtse.

High Tg PCBs utilize modified epoxy resin systems with a glass transition temperature Tg >= 170°C (IPC-4101/126, /99 or equivalent high-performance specs). At temperatures exceeding Tg, standard FR-4 (Tg approx. 135°C – 140°C) shifts from a rigid glassy state to a rubbery state, accelerating Z-axis expansion and mechanical shear stress on plated-through holes (PTH). High Tg variants suppress Z-CTE (alpha_1: 45 – 50 ppm/°C; alpha_2: 220 – 250 ppm/°C) and elevate thermal decomposition threshold (Td >= 340 degree).

Muaj Stackups:1 mus rau 24 txheej (txheej)

Standard Laminate Hom Stocked:Isola 370HR, Shengyi S1000-2, Panasonic R-1755 (los yog sib npaug hauv cheeb tsam muaj kev ntseeg siab sib npaug ntawm BOM khov)

Hom Z-axis expansion mitigation: Minimized barrel cracking through controlled drill-feed and direct metallization ratio >= 25 um tooj liab phab ntsa thickness.

Kev them nyiaj yug Engineering:Kev pom zoo pub dawb stackup & DfM kos npe -tawm ua ntej siv.

High-Tg Lead-PCB dawb

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Siab -Tg Multilayer PCB

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Halogen{0}}Dawb High-Tg PCB

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180℃Siab -Tg PCB

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170℃Siab -Tg PCB

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Siab -Tg FR-4 PCB

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Technical Specifications

Parameter	Specification txwv	Standard / Test Method
Kev hloov pauv iav (Tg)	Ci ntawm 170 txog 210 degrees	DSC (IPC{0}}TM-650 2.4.25)
Thermal Decomposition (Td)	>= 340℃(5% wt poob)	TGA
Z-Axis CTE (alpha_1 / alpha_2)	45 ppm /℃/ 250 ppm /℃(50℃- 260 degree)	TMA (IPC-TM-650 2.4.24)
Thermal Stress (Solder Float)	288°C >= 300 vib nas this (tsis muaj delamination)	IPC{0}}TM-650 2.4.13.1
Kev nqus dej	<= 0.10%	24-teev immersion
Peel zog	>= 0.70 N/mm (1 oz tooj liab)	IPC{0}}TM-650 2.4.8
Txheej Count Range	1-24 txheej	IPC-A-600 Chav Kawm 2 / Chav Kawm 3
Board Thickness	0.40mm 3<= T <= 3.20 mm	Mechanical kam rau ua +/- 10%
Min. Trace / Qhov chaw (Inner / Outer)	3.5 / 3.5 mil (90 / 90 um)	Laser / LDI duab
Min. PTH Qhov Loj (Tiav)	0.15 hli (mechanical) / 0.10 hli (laser microvia)	Aspect ratio mus txog 12: 1
Nto tiav	ENIG, HASL-Lead Free, Immersion Silver, OSP, ENEPIG	IPC-4552 / IPC-4554

Ntsiab nta

Siab Thermal Fatigue Resistance

Sustains > 1000 thermal cycles (-40℃rau +125℃lub hnab ntawv ua haujlwm) yam tsis muaj chim qaug zog hauv cov khoom hnyav-tooj liab.

Tsawg Moisture -Induced Delamination

Hloov kho dual-functional/multifunctional epoxy matrix tiv thaiv cov dej noo-flash blistering thaum lub sij hawm ua raws cov txhuas{2}}dawb reflow (260℃ncov profile).

Tswj impedance kam rau ua

Dielectric qhov tsis tu ncua (Dk=4.2 - 4.4 ntawm 1 GHz) nruj batch-tswj los ntawm resin-cov ntsiab lus pov thawj (+/- 1.5%), txhawb siab - ceev rooj vag tsav tsheb teeb liab nrog rau lub dav hlau fais fab.

Hnyav tooj liab Compatibility

Co- laminate muaj peev xwm mus txog 3 oz sab nrauv / 4 oz sab hauv txheej ua ke nrog thermal nyem kab noj hniav milling.

Daim ntawv thov

Sector	Tshwj xeeb Subsystem	Thermal / Mechanical Stress Profile
Fais fab Electronics	Hloov- hom khoom siv hluav taws xob (SMPS> 2kW), inverter tswj pawg thawj coj saib	Nruam ambient 85℃- 105 degree, localized tivthaiv kub -spots 130℃.
Automotive	Ntawm -board chargers (OBC), DC-DC converters, motor theem controllers	Hauv qab -hood vibration profile, thermal shock cycling per AEC-Q100/103 ib puag ncig kev cia siab.
Muaj Automation	Servo tsav, PLC backplanes, siab -cov tsav tsheb muaj LED	Multi-hloov ua haujlwm tsis tu ncua, siab ambient txee temp (70℃sab hauv sawv).
Kev sib txuas lus	Base chaw nres tsheb RF fais fab amplifier (PA) bias/control cards	Mixed thermal density, nruj microstrip impedance txwv.

Customization Options

Stackup Customization:Hybrid stackups (High-Tg core + qis-poob sab nrauv prepreg) muaj nyob rau ntawm kev xa tawm ntawm layout cross-section yuav tsum.

Copper Distribution:Asymmetric tooj liab hnyav sib npaug nrog thermal tooj - tub sab polygons los tiv thaiv hneev - thiab - twist thaum nias (< 0.5%).

Mask & Legend:LPI solder mask (Taiyo PSR-4000 series, ntsuab/dub/matte dub) + tshav kub-kho dawb/daj cov lus dab neeg; laser-scribed serial/batch UID matrix code.

Routing & Profileing:Routing router ntsis kam rau ua +/- 0.10 hli, V- qhab nias qhov tob +/- 0.1 hli qhov web thickness (1/3 txog 1/2 board thickness).

Kev Tswj Xyuas Zoo

Incoming Material Verification:DSC iav -Kev hloov pauv kev txheeb xyuas ntawm cov khoom siv laminate ntau cov qauv ua ntej sab hauv - txheej shear.

Sab hauv -Txheej Tshuaj Ntsuam Xyuas:AOI (Automatic Optical Inspection) ntawm 100% ntawm cov khaubncaws sab nraud povtseg rau kab dav, etch residue, thiab microshorts.

Nias-Fit / Stack Press Record:Traceable hydraulic xovxwm cav (kub nkhaus, ramp tus nqi, tuav siab profile archived ib batch ID).

Thaum kawg Hluav Taws Xob & Kev Ntsuas Kev Ua Phem:

100% Flying Probe test (netlist-driven) lossis Fixture Nail-Bed test for volume orders.
Microsection tsom xam rau ib lub vaj huam sib luag batch: plating thickness, solder float verification, thiab etch factor cross-check.

Ua raws li:IPC-A-600 Chav Kawm 3 ua raws kev soj ntsuam txoj kev muaj nyob ntawm kev thov.

Manufacturing & Certifications

Chaw Profile

Nruab nrab - mus rau - siab sib xyaw ua ke PCB raug cog, 45,000 m^2 muaj peev xwm txhua hli.

Txheej Txheem Ua & Tshawb Xyuas Anchor

Visual / Analytical pov thawj:Batch microsection cross-section sample verified via optical metallography showing barrel copper wall thickness >= 25 um thiab void- pub dawb resin sau.

Cov txheej txheem tseem ceeb ntawm cov khoom siv kab

Direct Imaging (LDI) kab:Orbotech/Mania sib npaug siab - daws teeb meem raug
Sequential lamination presses:Multidaylight lub tshuab nqus tsev thermal presses nrog kaw -loop siab tawm tswv yim
Drilling: Schmoll high-speed multi-spindle CNC drills (>150,000 RPM)

Cov ntawv pov thawj

ISO 9001: 2015, IATF 16949: 2016 (Automotive quality management Scope), ISO 14001:2015, UL File No. E-prefix (UL94 V-0 nplaim taws ntsuam xyuas kev siv laminate).

Ntim & Xa

Ntim Standard

Nqus - kaw ESD los tiv thaiv- lub hnab zoo li qub nrog cov dej noo- daim npav qhia (MIC) thiab silica gel desiccant packs (< 10% RH envelope), stacked in double-walled corrugated carton with custom foam corner dampening. Shelf life preservation: vacuum bag sealed up to 6 months.

Logistics & Volume Ramp Support

NPI Lub Sijhawm Ua Haujlwm:5-7 hnub ua haujlwm (panellized)
Volume Ramp-Up:2 – 3 lub lis piam xa tawm - Thawj Tshooj (FA) pom zoo
Shipping:FOB / EXW / DDP ntawm DHL / FedEx Express (prototypes) los yog huab cua / hiav txwv freight palletized rau ntim ntau lawm. Batch daim ntawv pov thawj ntawm conformance (CoC) thiab cov ntaub ntawv mill test (MTR) nrog rau txhua lub thawv xa khoom.

FAQ

Q: Koj puas xav tau cov neeg siv khoom- cov npe laminate tshwj xeeb (xws li Isola 370HR), lossis koj puas siv qhov sib npaug?

A: Peb npaj ob qho tib si teev npe laminates (Isola, Shengyi) thiab tsim nyog IPC-4101/126 sib npaug hauv cheeb tsam Tshuag. Yog tias koj AVL txwv tsis pub cov laminate hla kev hloov pauv, nco ntsoov lub npe xauv ntawm koj PO; txwv tsis pub, cov ntaub ntawv qib tau ntawv pov thawj rau ib daim ntawv spec.

Q: Dab tsi yog cov hlau lead-lub sij hawm cuam tshuam rau High Tg khoom vs standard FR-4?

A: Zero lead-time adder rau standard stackups siv stocked Tg 170℃nplooj ntawv. Tsis yog - qauv thicknesses (< 0.6 mm or > 2.4 mm) require 2 – 3 additional days for core allocation.

Q: Koj ua li cas tswj hneev thiab twist ntawm hnyav - tooj liab High Tg multi- txheej boards?

A: Cov tooj liab sib npaug ntawm cov khaubncaws sab nraud povtseg thiab symmetrical prepreg symmetrical xovxwm layups. Tshaj tawm-nias kub-flattening fixture thov rau nam piv ntau tshaj IPC Chav Kawm 3 txwv.

Q: Cov khoom siv siab Tg puas tuaj yeem ua tiav nrog cov qauv txhuas -SAC305 profile dawb?

A: Yes. Tg >= 170 cov ntaub ntawv kawm qib siab siab siab reflow 260℃rau 30 - 40 vib nas this standard 6-reflow thermal budget windows.

Thov ib daim Quote

Kev xa tawm Channel:Direct Engineering Mailbox (NDA tiv thaiv): (lossis portal upload nrog nws pib -NDA token).
Yuav tsum tau pob / Metadata:Gerber RS-274X lossis ODB++, centroid/pick-thiab-qhov chaw cov ntaub ntawv (yog tias tsim nyog), IPC chav kawm yuav tsum tau, lub hom phiaj ntim qib (NPI vs Batch), cov khoom siv qib Tg nyiam, nto tiav, pawg thawj coj pawg ntaub ntawv / thickness txwv, lub hom phiaj xa khoom hnub.
Engineering Review Turnaround:Pub dawb DfM cov lus nug tawm tswv yim, pawg kos npe - tawm cov ntawv, thiab kab - cov lus hais xa tuaj hauv 12 - 24 teev ua haujlwm.

Nrog kev paub ntau ntxiv, peb yog ib tus kws tshaj lij tg pcbs manufacturers thiab cov muag khoom hauv Suav teb. Peb sov siab txais tos koj mus yuav cov khoom zoo siab tg pcbs muag ntawm no los ntawm peb lub hoobkas. Yog tias koj muaj lus nug txog kev koom tes, thov koj xav email rau peb.