HDI PCBs

Qeb khoom

Cov Khoom Kawg

Tiv tauj peb

TEL:+8618948705000
Email:sales@Ldtac.com
Ntxiv: 5th pem teb, Tsev 1, Jinshan Industrial Park, 375, Xixiang Section, Guangshen Road, Xixiang Street, Baoan District, Shenzhen City, Guangdong Province, Suav teb

High -Density Interconnect (HDI) PCBs

Tsim-rau-Spec Custom Rigid PCBs|IPC-6012 Chav Kawm 3 / Chav Kawm 3 / A Ua raws

Hom qauv:1+n+1, 2+n+2, 3+n+3, Ib qho - txheej (ELIC - Txhua Txheej Kev Sib Txuas).

Txheej suav:4 mus rau 24 txheej (HDI core build-ups).

Core Khoom Dk / Df Alignment: FR-4 (Tg >= 170℃), Tsawg-tsis hydrocarbons (Rogers RO4000 series), Siab- nrawm qis-Df laminates (Panasonic Megtron 4/6/7, Isola Tachyon 100G).

Primary Value Delivery:High I / O ceev BGA pitch breakout (<= 0.4 mm pitch), controlled impedance integrity up to 28/56/112 Gbps PAM4, reduced layer count vs. standard multi-layer via blind/buried schemes.

HDI Rigid -Flex PCB

Ntxiv rau Kev Nug
Siab -Density Interconnect PCB

Ntxiv rau Kev Nug
Microvia HDI PCB

Ntxiv rau Kev Nug
Txhua yam - Txheej HDI PCB

Ntxiv rau Kev Nug
1+N+1 HDI PCB

Ntxiv rau Kev Nug
2+N+2 HDI PCB

Ntxiv rau Kev Nug

Technical Specifications

Parameter	Muaj peev xwm / Ntau	Ntau lawm txwv / kam rau ua
Max Layer suav	24 txheej	Stackup- nyob ntawm
Min Kab Dav / Qhov Chaw (L / S)	Sab hauv: 2/2 mil (50 µm), Outer: 3/3 mil	Etching kam rau ua ± 0.5mil
Laser ntawm Diameter	3 mus rau 6 mil (75-150 µm)	Aspect ratio<= 0.8:1
Stacked / Staggered Vias	Mus txog 3-theem stacked ntawm-hauv-pad	Sau nrog conductive/non{0}}conductive epoxy & capped
Ua tiav Board Thickness	0.4mm txog 3.2mm	± 10% tag nrho thickness
Tswj impedance	50 Ω ib leeg - xaus, 100 Ω txawv khub	± 10% tus qauv (± 5% nruj tswj ntawm kev thov)
Nto tiav	ENIG, ENEPIG, Immersion Ag, Immersion Sn, OSP, HASL (lead{0}}free)	IPC -PL-09 / IPC-4552 specs
Max Vaj Huam Sib Luag Loj	530mm × 610 hli	Siv tau zoo routing cheeb tsam ib lub vaj huam sib luag txoj cai

Ntsiab nta

Sequential Laser Ablation

UV / CO2 hybrid laser routing ua rau lub hom phiaj microvia tsim yam tsis muaj kev ntxhov siab thermal tawg ntawm cov dielectrics nyob ib sab.

Ntawm -hauv -Pad Copper Plating

Planarized los ntawm kev sau (ntawm qhov tob tob kev nyuaj siab < 15 µm) tiv thaiv kev sib tsoo thiab pob - kab sib chaws - array (BGA) voiding thaum lub sij hawm reflow.

Tswj Resin Flow Prepreg

Ultra-thin prepregs (2 mil mus rau 3 mil) ua ke nrog laser -drilled sub-composites suppress internal void nucleation nyob rau hauv siab - txheej - suav tsim.

Laser Direct Duab (LDI)

Kev tso npe kam rau ua ± 15 µm txheej - rau - txheej txheej kom nruj pitch BGA pob.

Daim ntawv thov

Sector	Daim ntawv thov tshwj xeeb	Critical Technical Driver
Telecom / Datacom	5G RU baseband boards, 100G / 400G optical modules	Kev poob qis qis (Df<= 0.004), skew control
AI / Siab -Speed Computing	GPU/ASIC accelerator carrier boards	Siab -lub zog ceev / av dav hlau faib, 0.4 hli suab BGA
Kev kho mob Electronics	Ultrasound sojntsuam beamformers, portable defibrillators	Kev ntseeg siab Class 3/A, micro-miniaturization
Industrial / Robotics	Servo tsav controllers, ntau -axis lus tawm tswv yim	High vibration resilience, thermal dissipation ntawm thermal vias

Kev kho kom haum

Stackup Co-Tsim:Xa schematic, stackup phiaj, lossis netlist; engineering rov qab ua tiav stackup nrog Df / Dk them nyiaj thiab impedance profile hauv 24 teev.

Plug Material Options:Copper-filled conductive paste (ntawm filling resistivity < 25 µΩ·cm) vs. non-conductive epoxy (Epoxy Technolog/San-Ei).

Selective Plating:Xaiv kub thickness txog li 30 µin ntawm ntug connectors thaum tswj tus qauv ENIG ntawm BGA pads.

Routing Hloov Kho:Kev zam ntawm DFM tau ua tiav nrog kev kos npe ncaj qha engineering -tawm.

Kev Tswj Xyuas Zoo

AOI (Automated Optical Inspection):100% sab hauv / txheej txheej kab dav / qhov chaw pov thawj ncej-etch.

XRF (X-ray Fluorescence):Thickness verification per lot (ENIG Au 2–4 µin, Ni 120–240 µin).

Microsection Analysis: 3 samples per production batch verified for copper barrel thickness (>20 µm min), resin sau qhov siab, thiab thermal stress integrity (288 degree, 10 vib nas this, 3 cycles ib IPC-TM-650 2.6.8).

Kev kuaj hluav taws xob:100% ya soj ntsuam kuaj (rau tus qauv<= 50 pcs or high-density low volume) or fixture-based bed-of-nails (for volume > 1000 pcs). Isolation threshold > 10 MΩ at 250V/500V.

Manufacturing & Certifications

Cog Footprint Snapshot

Dongguan chaw tsim khoom|18,000 m² cleanroom ib puag ncig|Lub hli muaj peev xwm: 45,000 m² multi- txheej / HDI panels. Chav kawm 10,000 qhov chaw huv chav raug rau sab hauv - txheej txheej zaj duab xis qhuav lamination thiab laser drilling.

Cov Khoom Siv Core

Orbotech Paragon LDI systems
Hitachi UV/CO2 dual- lub taub hau laser laum chaw nres tsheb
Atotech ncaj nraim nruam plating (VCP) kab

Quality Management Systems

ISO 9001: 2015
IATF 16949: 2016 (Automotive electronics subset kab)
ISO 13485: 2016 Kev kho cov cuab yeej zoo

IPC Standard Baseline

IPC-6012 Class 3 (default for high-reliability/HDI), IPC-A-600 Class 3 kev lees txais.

Kev tswj hwm & Ua raws cai

RoHS directive compliant, REACH SVHC tshaj tawm npaj, CMRT teeb meem minerals qhia txhawb.

Ntim & Xa

Nqus Sealing

Anti- zoo li qub noo noo- cov hnab thaiv (MBB, < 0.02 g/m²/24h WVTR) nrog Cov Ntawv Qhia Txog Humidity Indicator Cards (HIC) thiab Hom A molecular sieve desiccant.

Kev tiv thaiv lub cev

Ntug- buffered corrugated cartons nrog ib tus neeg kaw- cell foam interleaving; warp- tiv thaiv clamping fixtures rau nyias boards (< 0.8 mm).

Lub Sijhawm Lead

Tus qauv (1–3n+1):5-7 hnub ua hauj lwm (tus qauv tshuaj xyuas) / 3 hnub ua hauj lwm (expedited NPI).
Volume Pilot Khiav:10–14 hnub ua haujlwm tom qab-PPAP kos npe- tawm.

Logistics

DDP / EXW / FOB ntawm DHL / FedEx Express (air freight prototype) los yog palletized dej hiav txwv freight (ntim).

FAQ

Q: Koj qhov tsawg kawg nkaus annular nplhaib yuav tsum tau rau laser microvias ntawm txheej txheej?

A: Yam tsawg kawg nkaus 3 mil (75 µm) annular nplhaib ntawm cov ntaub qhwv. Tsis yog -functional pad removal (NFPR) yog siv los ntawm lub neej ntawd tshwj tsis yog tau teev lwm yam hauv ODB++ txheej txheej sau ntawv.

Q: Koj yuav ua li cas thiaj li ua tau qhov txawv ntawm cov qauv impedance ntawm cov neeg siv khoom -muab simulation thiab qhov tseeb pawg thawj coj?

A: Teb-Kev txheeb xyuas qhov tseeb (Polar Si8000/Si9000) yog khiav ua ntej- ntau lawm. Yog tias dielectric thickness kam rau hloov pauv qhov dav ntawm qhov ntsuas los ntawm> 0.2 mil, engineering teeb meem kev nug txog engineering (EQ) nrog kev kho etch nyiaj ua ntej kos duab kos duab.

Q: Koj puas tuaj yeem txhawb nqa stacked microvias ncaj qha hla faus core vias (sau thiab capped)?

A: Yog. Stacked microvia cov qauv mus txog qib-3 tshaj sau / capped faus vias yog tus qauv hauv 3+n+3 tsim. Planarization polish ua kom lub ntsej muag coplanarity hauv ± 5 µm.

Q: Cov ntaub ntawv pob hom twg yog qhov zoo dua rau HDI tso rau ntau lawm?

A: ODB++ (nyiam dua, ib zaug-database hierarchy) los yog Gerber RS-274X nrog rau IPC-D-356 netlist thiab fab kos duab nrog lub rooj stackup.

Q: Koj ua li cas txog kev ua txhaum cai DFM (xws li, kev pheej hmoo ntawm L2 microvia)?

A: Peb chij ntawm - mus rau - taug qab clearance < 3 mil ntawm kev cai EQ. Kev tsim khoom tsis tso tawm kom txog thaum kos npe zam lossis kho Gerber rov qab - uploaded.

Thov ib daim Quote

Commercial & Volume Tiers:
Prototype / NPI:5-25 pcs (3-5 hnub ua haujlwm tig)
Pilot Khiav:50-500 pcs (MOQ hloov tau rau ib pawg complexity)
Ntim:1, 000+ pcs (cov khoom xa tuaj lossis daim ntawv cog lus muaj sijhawm teem sijhawm)

Nrog kev paub ntau, peb yog ib tus kws tshaj lij hdi pcbs tuam ntxhab thiab cov muag khoom hauv Suav teb. Peb sov siab txais tos koj mus yuav bulk zoo hdi pcbs muag ntawm no los ntawm peb lub hoobkas. Yog tias koj muaj lus nug txog kev koom tes, thov koj xav email rau peb.