High-PCBs ceev yog qhov tseeb-engineered multi- txheej luam ntawv Circuit Court boards ua rau siab -frequency signal integrity thiab low-tsis kis. Tsim los txhawb ntau-gigabit cov ntaub ntawv tus nqi (25Gbps rau 112Gbps + NRZ/PAM4), cov boards siv tshwj xeeb qis-Dk/Df laminate cov ntaub ntawv, nruj tswj tooj liab roughness, thiab siab impedance txuam. Tsim nyob rau hauv ISO 9001 thiab IATF 16949 certified chaw, cov kab ntau lawm feature laser direct imaging (LDI), tswj impedance kuaj ntawm TDR, thiab automated optical inspection (AOI) kom tau raws li nruj IPC Class 3 qauv rau cov ntaub ntawv chaw, telecom, thiab automotive infrastructure. Scaling los ntawm ib qho -daim qauv sai sai mus rau ntim ntau lawm sau ntau tshaj 100,000 units, manufacturing workflows haum ob leeg agile engineering validation thiab ruaj khov khoom lag luam.
|
Parameter |
Specification Range |
|
Max Layer suav |
Txog li 40 Layers |
|
Dielectric qhov tsis tu ncua (Dk) |
2.2 rau 3.8 (ntawm 10 GHz) |
|
Dissipation Factor (Df) |
0.0011-0.0050 Nws |
|
Impedance kam rau ua |
+/- 5 feem pua (Kev tswj nruj rau +/- 3 feem pua muaj) |
|
Min Trace/Space |
3.0 mil / 3.0 mil (75 um / 75 um) |
|
Min Laser Ntawm Qhov Loj |
3.0 mil (75 um), Stacked/Staggered Microvias |
|
Board Thickness |
0.20mm txog 6.0mm |
|
Max Vaj Huam Sib Luag Loj |
600 x 700 mm |
|
Copper Foil Hom |
RTF (Reverse Treated Foil), VLP, HVLP, ED Copper |
|
Nto tiav |
ENIG, ENEPIG, Immersion Silver, Immersion Tin, OSP |
Tswj Dielectric Constants
Siv hydrocarbon ceramic thermoset thiab qis -poob PTFE laminates kom txo cov teeb liab kev nthuav tawm qeeb thiab theem distortion.
01
Ultra-Low Loss Profiles
Ua haujlwm ultra-tsawg profile (VLP/HVLP) tooj liab foils los txo cov neeg xyuas pib los ntawm cov tawv nqaij ntawm cov zaus ntau tshaj 10 GHz.
02
Precise Impedance Architecture
Ib zaug- xaus thiab txawv impedance qauv siv Polar SI8000/9000, txhawb nqa los ntawm 100% Lub Sijhawm Domain Reflectometry (TDR) pov thawj ntawm txhua lub vaj huam sib luag tsim.
03
Advanced Microvia Technology
Sequential lamination txhawb HDI cov qauv mus txog 3+N+3 rau siab - ntom pob kab sib chaws (BGA) kiv cua- tawm.
04
Thermal stability
Kev hloov pauv ntawm iav siab (Tg> 210 ° C) thiab qis Z-axis thermal expansion coefficient (CTE) tiv thaiv lub chim tawg thaum lub sij hawm txhuas -dawb sib dhos reflow.
05

Data Center & Cloud Computing:400G/800G Ethernet keyboards, kab phaib, server motherboards, thiab siab -ceev backplanes.
Kev Sib Txuas Lus:5G Massive MIMO active kav hlau txais xov units (AAUs), core network routers, thiab microwave kis systems.
Automotive Systems:Advanced Driver Assistance Systems (ADAS) radar sensors, LiDAR processing units, thiab high -frequency infotainment links.
Kev Ntsuas & Ntsuas:Siab -bandwidth oscilloscope nrhiav tau boards, semiconductor automated test equipment (ATE), thiab vector network analyzers.
Khoom Hybridization
Ua ke siab - nrawm qis- cov khoom poob (piv txwv li, Rogers RO4000 series, Panasonic Megtron) nrog tus qauv FR-4 (xws li Shengyi S1000-2) hauv kev sib xyaw ua ke kom sib npaug ntawm kev ua haujlwm siab thiab tus nqi.
Stack -up Optimization
Kev txhawb nqa engineering los simulate teeb liab kev ncaj ncees, kho dielectric thicknesses, thiab xam cov kab dav dav ua ntej fabrication.
Routing & Anti-Pad Design
Kev cai tshem tawm kev hloov kho, tiv thaiv-pad resizing, thiab rov qab-drilling (stub tshem tawm) kom tshem tawm resonance ntawm stub frequencies.
Kev tsim tshwj xeeb
Hlau -rov qab PCBs (txhuas / tooj liab puag), kab noj hniav PCBs, thiab embedded passive Cheebtsam.
Kev tshuaj xyuas cov khoom tuaj
Dielectric tsis tu ncua pov thawj, tooj liab tev lub zog kuaj, thiab ultrasonic scanning (CSAM) rau laminate voids thiab noo noo nqus.
Kev soj ntsuam xyuas
Tiag -lub sij hawm plating da dej tshuaj ntsuam xyuas, laser drilling qhov chaw raug kuaj xyuas (+/- 10 um), thiab automated optical shaping tshuaj xyuas.
Hluav taws xob & Kev kuaj lub cev
100% hluav taws xob qhib / luv luv xeem siv ya sojntsuam lossis fixture testers; impedance pov thawj ntawm TDR daim coupon; solderability thiab thermal stress testing per IPC-TM-650.
Traceability
Laser -etched 2D matrix barcodes ntawm txhua lub vaj huam sib luag rau tag nrho cov khoom siv ntau thiab cov txheej txheem kev ntsuas ntsuas.
Kev khiav hauj lwm tawm ntawm 45,000-square- meter manufacturing cog nruab nrog Schmoll drilling tshuab, Orbotech LDI systems, Mania ya soj ntsuam kuaj, thiab ncaj qha - kab tooj liab electroplating systems. Peev xwm scales los ntawm ceev prototyping mus rau high-volume ntau lawm.
Cov ntawv pov thawj:ISO 9001: 2015, IATF 16949: 2016, ISO 14001: 2015, UL Certified (E354117), IPC -}A-600 Class 3 / IPC-6012 Class 3 raws.
Ntim:Lub tshuab nqus tsev- kaw los tiv thaiv- lub hnab zoo li qub nrog silica gel desiccant thiab humidity indicator cards (HIC), cushioned with layered EPE foam in two-wall corrugated cartons. Lub tshuab nqus tsev thermal sealing muaj rau cov dej noo-sensitive hybrid boards.
Logistics:Kev ncaj qha huab cua thiab dej hiav txwv freight koom tes nrog DHL, FedEx, thiab UPS rau expedited prototype delivery; consolidated pallet shipping rau ntim xaj nrog daim ntawv xa nyiaj lag luam thiab daim ntawv pov thawj ntawm kev ua raws (CoC) suav nrog.

Txhawm rau tau txais cov lus hais, xa koj cov ntaub ntawv Gerber (RS-274X lossis ODB++), laum cov ntaub ntawv, tsim cov duab kos, thiab cov khoom siv sib dhos ntawm daim ntawv ruaj ntseg hauv qab no lossis email ncaj qha rau peb pab pawg engineering.
Cov ntaub ntawv xav tau:Txheej suav, board qhov ntev, tiav thickness, tooj liab qhov hnyav, nto tiav, impedance tswj yuav tsum, kwv yees txhua xyoo ntim, thiab qauv piv rau ntim theem.
Lub sij hawm teb:Cov lus hais nrog cov ntaub ntawv ua tiav raug xa rov qab tsis pub dhau 12 teev ua haujlwm.
Nrog kev paub dhau los, peb yog ib tus kws tshaj lij kev kub ceev pcbs manufacturers thiab cov muag khoom hauv Suav teb. Peb sov siab txais tos koj mus yuav bulk zoo siab ceev pcbs muag ntawm no los ntawm peb lub hoobkas. Yog tias koj muaj lus nug txog kev koom tes, thov koj xav email rau peb.