Multilayer PCBs

Qeb khoom

Cov Khoom Kawg

Tiv tauj peb

TEL:+8618948705000
Email:sales@Ldtac.com
Ntxiv: 5th pem teb, Tsev 1, Jinshan Industrial Park, 375, Xixiang Section, Guangshen Road, Xixiang Street, Baoan District, Shenzhen City, Guangdong Province, Suav teb

Multilayer PCBs (4–32 Txheej)|Rigid Custom Printed Circuit Boards

Precision-engineered multilayer stackups rau kev lag luam, kev kho mob, thiab siab -kev cia siab rau OEM kho vajtse. Ua rau IPC-A-600 Chav Kawm 2/3. Impedance{11}}tswj mus rau +/-10%. ITAR-exempt coj mus muag khoom saw.

Siab -Txheej- suav Multilayer PCB

Ntxiv rau Kev Nug
12-Txheej Multilayer PCB

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10-Txheej Multilayer PCB

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8-Txheej Multilayer PCB

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6-Txheej Multilayer PCB

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4-Txheej Multilayer PCB

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Product Overview

Parameter	Specification Profile
Txheej suav	4 mus rau 32 khaubncaws sab nraud povtseg (txawm tias stackups txheem; khib stackups ntawm kev tshuaj xyuas)
Hom Board	Txheem nruj, HDI (Txhua yam - txheej / 1+N+1), Siab- zaus (Rogers / Taconic hybrid)
Standard Volume Lead Time	Qauv: 5-7 hnub
Kev txais cov ntaub ntawv	Gerber RS-274X, ODB++, IPC-2581; NC Drill (Excellon), IPC-D-356 netlist

Technical Specifications

Feature Qeb	Muaj peev xwm tsim tau / txwv	Standard Tolerance / IPC Chav Kawm
Ua tiav Thickness	0.4mm - 4.5 hli	+/- 10% (tag nrho)
Min Trace / Chaw	3.0 hli / 3.0 mil (0.075mm / 0.075mm)	+/- 20% lossis +/- 0.5 mil
Mini Laser Via (HDI)	0.1mm (4 mil) qhov muag tsis pom / faus	IPC-6012 Chav Kawm 2/3
Min Mechanical Qhov	0.15 hli (6 mil)	+/- 0.05mm plated
Copper Luj (Inner / Outer)	0.5 oz mus rau 4 oz ua tiav	Kev ua raws li IPC-2221
Nto tiav	ENIG (IPC-4552), OSP (IPC-4553), Immersion Ag, Hard Kub (ntug connectors)	Thickness tau lees paub los ntawm XRF
Solder Mask	LPI (Green, Dub Matte, Xiav, Liab, Dawb)	IPC -SM-840E
Impedance Tswj	Ib leeg- xaus (50 ohm), sib txawv (90 ohm / 100 ohm)	+/- 10% TDR daim coupon pov thawj
Base Laminate Khoom	Isola (FR408HR, 370HR), Ventec (VT-47), Panasonic (MEGTRON 6), Rogers (RO4350B)	Tg >= 170 degC rau suav txheej siab

Ntsiab nta

Tswj Dielectric Stackup

Symmetric prepreg / core sequencing matched rau TDR simulation qhia ua ntej lamination xovxwm.

Ntawm -hauv -Pad Electroplating

Resin-sau thiab tooj liab-plated dhau ntawm cov txheej txheem rau siab -BGA breakout (0.4mm suab).

Siab -Tg Thermal Resilience

Thermal stress survival los ntawm 6x lead-dawb IR reflow profiles (260 degC ncov) yam tsis muaj delamination lossis chim tawg.

Ntug Plating / Castellated Qhov

Plated ib nrab- qhov (0.6mm txoj kab uas hla) rau tus ntxhais-rau-motherboard ntsug ntsaws- hauv cov qauv.

Daim ntawv thov

Industrial Automation:PLC backplanes, multi-axis axis motion controller boards (6–12 txheej, hnyav 2 oz fais fab dav hlau).

Kev Sib Txuas Lus:Core hloov linecards, siab - zaus RF transceiver modules (hybrid FR4/Rogers 16–24 txheej).

Kho Mob Diagnostic Hardware:Ultrasound frontend teeb liab ua, tus neeg mob saib xyuas cov ntaub ntawv tau txais motherboards (tsawg- suab nrov hauv av stitching).

Automotive Subsystems:LiDAR interface boards, roj teeb tswj qhov system (BMS) saib xyuas PCBs (IPC-A-600 Class 3).

Customization & Engineering Support

DFM/DFAsing Review Scope

24-hour turnaround engineering query report highlighting annular ring violations, acid traps, unanchored copper, and aspect ratio risks (>10: 1 xyaum qhov tob- mus rau - txoj kab uas hla yuav tsum tau ntsuas qhov ntsuas thib ob).

Stackup Customization

Muab lub hom phiaj impedance qhov tseem ceeb (Z0) thiab pawg qhov siab txwv; engineering tsim impedance daim coupon tsim ib txheej.

Panelization

Cov neeg siv khoom- txhais cov khoom siv, cov cuab yeej qhov (3.175mm), V- txiav qhov tob / lub web kam rau ua (0.3mm +/-0.05mm), lossis tab- txoj kev taug kev nrog cov nas tsuag tawg.

Buffer Stock & VMI Management

Dedicated kev ruaj ntseg cov kev pab cuam (cov neeg siv khoom- muaj lossis fab- tuav cov khoom lag luam) ntev - cov khoom siv tshwj xeeb (Rogers / Megtron 6) txhawm rau tshem tawm cov kab khiav ntau ntau - nres.

Kev Tswj Xyuas Zoo

Kev soj ntsuam & kuaj rooj vag

AOI (Automated Optical Inspection):Inner layers post-etch, txheej txheej post-solder mask.
Flying Probe Test:Nets txheeb xyuas ntawm 100% ntawm cov qauv (< net resistance thresholds).
E-Test (Fixture):Applied for batch runs >250 pcs.
Microsection Analysis: Destructive physical analysis per lot for plating thickness, barrel copper uniformity (>20 um min chim phab ntsa rau Chav Kawm 3), thiab dielectric spacing.

Traceability

Laser -etched hnub code, batch tracking, thiab cov ntaub ntawv COC (Certificate of Conformance) khaws cia digitally rau ntau.

Manufacturing & Certifications

Plant Profile & Footprint:

Chaw Nyob:Export-raws li kev lag luam kev lag luam hauv paus (ITAR- zam kev lag luam cov saw hlau, Asia / thoob ntiaj teb export logistics hub).
Lamination xovxwm kab:4 siab -temp nqus hydraulic presses.
Laser drilling:Schmoll / Orbotech UV / CO2 laser laum rigs.
Plating kab:Vertical nruam plating kab nrog periodic mem tes rov qab (PPR) tooj liab faib.

Kev Ua Raws Cai:ISO 9001: 2015, IATF 16949 (secondary automotive scope), ISO 13485 (kev kho mob subset), UL E- ntaub ntawv pov thawj, RoHS/REACH raws.

Ntim & Xa

Ntim Standard:Lub tshuab nqus tsev- kaw cov khoom tiv thaiv- zoo li qub ESD hnab (<10^11 ohm/sq), silica gel desiccant packs, humidity indicator card (HIC), double-walled corrugated cartons with 50mm corner foam inserts. Baking protocol applied (120 degC for 4–24 hours) prior to vacuum seal if shelf-life window requires.

Logistics:FOB / EXW / DDP ntawm DHL / FedEx Express (prototypes) los yog palletized huab cua / hiav txwv freight (ntim batch). Daim ntawv tshaj tawm kev lag luam, daim ntawv teev npe, COC, thiab daim ntawv qhia microsection suav nrog hauv cov ntaub ntawv xa khoom.

FAQ

Q: Koj qhov piv txwv siab tshaj plaws yog dab tsi rau los ntawm - qhov plating ntawm 16+ txheej boards?

A: Tus qauv nam piv txwv yog 10: 1 rau cov tshuab drilling (0.2 hli laum ntawm 2.0mm board thickness). Rau qhov siab dua qhov sib piv mus txog 14: 1, kev ua haujlwm yuav tsum muaj cov khoom siv tshwj xeeb nkag thiab kev tshuaj xyuas ua ntu zus.

Q: Koj puas them nyiaj ntxiv rau impedance daim coupon fabrication thiab TDR daim ntawv xeem?

A: Impedance daim coupon kev koom ua ke ntawm kev tsim vaj huam sib luag chaw pov tseg yog suav nrog tsis muaj nqi ntxiv rau kev txiav txim yuav tsum tau tswj hwm impedance specs; TDR cov ntawv xeem cov ntsiab lus tau txheeb xyuas thiab txuas nrog cov ntawv xa khoom.

Q: Koj ua li cas thiaj li sib xyaw dielectric stackups (xws li Rogers siab - zaus tub ntxhais nrog FR4 prepreg)?

A: Cov khoom stackup yuav tsum tau thermal expansion coefficient (CTE) ntsuas. Peb hloov qhov sib txuam siab -Tg prepreg bondplies (xws li, FR408HR resin system) los tiv thaiv delamination thaum z-axis thermal stress. Xa cov lus pom zoo los yog cia peb pab pawg PE tshaj tawm ua ntej - lamination tshuav nyiaj li cas.

Q: Dab tsi ntawm cov ntaub ntawv tsis sib xws halts kab ua?

A: Cov npe uas ploj lawm, tsis tau muab NC cov cuab yeej khib nyiab, lossis Gerber tswj tsis sib haum (inch vs. metric scale offset). Peb DFM tuav daim ntawv ceeb toom ncua kev tsim khoom hauv 4 teev tom qab tau txais cov ntaub ntawv.

Q: Koj puas tuaj yeem txhawb nqa VMI / tsis khoom Tshuag rau ntev - coj Rogers / Panasonic laminates thaum lub ntim ntim?

A: Yes. For annual forecasts involving constrained dielectrics (>6 lub lis piam raw khoom siv sij hawm ua ntej), peb tsim fab- tuav kev ruaj ntseg Tshuag dov daim ntawv cog lus khi rau koj lub sijhawm kwv yees tso tawm.

Thov ib daim Quote

PE ncaj qha cov lus teb hauv 4 teev ua haujlwm (pib-tau hla GMT, CET, thiab EST kev pab them nqi rooj ntawm
Yuav tsum tau Input Checklist:
Gerber cov ntaub ntawv (RS-274X) + Excellon laum cov ntaub ntawv
Stackup yuav tsum tau los yog phiaj tiav thickness (mm)
Nto tiav xaiv (ENIG, OSP, thiab lwm yam)
IPC Class yuav tsum tau (Class 2 lossis Class 3)
Lub hom phiaj ntim (Prototype / Pilot / Kev kwv yees txhua xyoo nrog VMI nyiam) thiab hnub xa khoom xav tau

Nrog kev paub ntau, peb yog ib qho ntawm cov kws tshaj lij multilayer pcbs manufacturers thiab cov muag khoom hauv Suav teb. Peb sov siab txais tos koj mus yuav bulk zoo multilayer pcbs muag ntawm no los ntawm peb lub hoobkas. Yog tias koj muaj lus nug txog kev koom tes, thov koj xa email tuaj rau peb.