Muaj hmoo Dragon Technology Shenzhen Co., Ltd.
+86-755-23074100
Tiv tauj peb
  • TEL:+8618948705000
  • Email:sales@Ldtac.com
  • Ntxiv: 5th pem teb, Tsev 1, Jinshan Industrial Park, 375, Xixiang Section, Guangshen Road, Xixiang Street, Baoan District, Shenzhen City, Guangdong Province, Suav teb
Siab -Txheej- suav Multilayer PCB

Siab -Txheej- suav Multilayer PCB

Siab - txheej - suav ntau txheej PCBs sib xyaw ua ke 10 rau 40+ cov txheej txheej tooj liab cuam tshuam nrog dielectric prepreg. Tsim los rau routing siab - cov cim ceev ceev thiab tswj cov kev sib txuas hluav taws xob sib txuas, cov laug cam no txhawb cov kev xav tau ntawm hluav taws xob thiab thermal hauv cov khoom siv hluav taws xob tuab.

Xa kev nug
  • Hauj lwm lawm

    Siab - txheej - suav ntau txheej PCBs sib xyaw ua ke 10 rau 40+ cov txheej txheej tooj liab cuam tshuam nrog dielectric prepreg. Tsim los rau routing siab - cov cim ceev ceev thiab tswj cov kev sib txuas hluav taws xob sib txuas, cov laug cam no txhawb cov kev xav tau ntawm hluav taws xob thiab thermal hauv cov khoom siv hluav taws xob tuab. Fabrication cia siab rau kev tswj kev sau npe nruj, kev tswj hwm lamination ua ntu zus, thiab tswj tau- qhov tob drilling kom muaj kev ncaj ncees ntawm kev sib sib zog nqus - pawg architectures.

     

    Technical Specifications

     

    Parameter

    Specification Range

    Txheej suav

    10 rau 40+ txheej

    Board Thickness

    1.0mm txog 6.0mm (Max Aspect Ratio 18:1)

    Min. Kab Dav / Qhov Chaw

    3.0mil / 3.0mil (0.075 hli / 0.075 mm)

    Min. Laser Laum Qhov Loj

    4 mil (0.1 hli)

    Cov ntaub ntawv hauv paus

    High-Tg FR-4 (Tg >= 170 deg. C), Megtron 6, Rogers RO4000 series, Isola

    Nto tiav

    ENIG, Immersion Silver, HASL (Lead{0}}free), OSP, Hard Gold

    Max. Board Loj

    600 x 500 mm

    IPC Txuj

    IPC-6012 Chav Kawm 2 / Chav Kawm 3 / Chav Kawm 3 / A

     

    Ntsiab nta

     

    Tswj Impedance Precision:Tight kab dav thiab dielectric thickness kam rau ua (+/- 5 feem pua) txhawb nqa los ntawm sab hauv teb- qauv daws teeb meem kom txo cov teeb liab cuam tshuam thiab attenuation.


    Advanced Via Structures:Kev them nyiaj yug rau cov lamination qhov muag tsis pom vias, faus vias, stacked vias, thiab ntawm - hauv -pad architectures los txhim kho txoj kev ceev thiab txoj hauv av.


    Dimensional Stability Control:Tsawg-Z-axis nthuav dav prepregs ua ke nrog kev ua kom zoo raws li cov kev sib tw nias kom tsis txhob sab hauv- txheej hloov thiab chim tawg thaum lub sij hawm thermal stress.


    Thermal Management Integration:Kev pab rau cov dav hlau hnyav tooj liab sab hauv (2 oz mus rau 4 oz) thiab thermal vias kom dissipate cov cua sov hauv zos los ntawm siab - cov khoom siv hluav taws xob.

     

    Daim ntawv thov

    Kev sib txuas lus

    5G lub hauv paus chaw nres tsheb routers, optical thauj network, thiab cov tub ntxhais network hloov.

    Data Centers & Computing

    High -cov servers ua tau zoo, blade servers, thiab networking backplanes.

    Khoom siv kho mob

    MRI controllers, CT scanner cov ntaub ntawv yuav khoom, thiab cov neeg saib xyuas cov kab ke.

    Aerospace & Kws muaj txuj ci

    Avionics navigation systems, radar processors, thiab satellite kev sib txuas lus modules.

     

    Kev kho kom haum

     

    Kev tsim khoom yoog raws li kev cai pawg-cov qauv tsim los ntawm Gerber lossis ODB++ cov ntaub ntawv tsim khoom. CAM engineering ua pawg- nce symmetry thiab resin- ntws simulations ua ntej cov cuab yeej tso tawm kom tsis txhob muaj kev pheej hmoo ntawm board warping thaum lub sij hawm thermal. Kev hloov khoom siv (piv txwv li, kev hloov pauv tus qauv FR-4 rau cov laminates qis zoo li Megtron 6) yog ua raws li cov txheej txheem dielectric tas li (Dk) thiab dissipation factor (Df) lub hom phiaj, nrog rau cov ntaub ntawv qhia txog impedance simulation.

     

    Kev Tswj Xyuas Zoo

     

    Ua ntej-Production DFM Review:Senior CAM engineers ua qhov kev xyaum nruj heev- rau- kev tshem tawm tooj liab, kua qaub, thiab pawg- nce symmetry checks ua ntej cov cuab yeej tso tawm rau tus chij fabrication txaus ntshai ntxov.


    AOI (Automated Optical Inspection):100% sab hauv- txheej tshuaj ntsuam xyuas rau qhib circuits, luv, thiab kab dav anomalies ua ntej lamination.


    X-Ray Inspection:Tiag -lub sij hawm pov thawj ntawm txheej-rau- txheej txheem sib dhos thiab laum breakout tiv thaiv ntawm ntau- txheej txheej.


    Flying Probe & Bed-ntawm-Nails Testing:Kev ntsuas hluav taws xob txuas ntxiv thiab kev cais tawm tau ua ib daim ntawv teev npe.


    Microsection Analysis:Kev tshuaj xyuas lub cev puas tsuaj ntawm kev xeem daim coupons ib qhov ntau ntau los xyuas cov tooj liab plating thickness, ntawm phab ntsa kev ncaj ncees, thiab solder mask thickness.

     

    Manufacturing & Certifications

     

    Nyob rau hauv - tsev fabrication siv ncaj qha laser imaging (DI) systems, multi- qhib lub tshuab nqus tsev lamination presses, thiab siab - precision CNC tshuab / laser xyaum. Lub khw- kev ua haujlwm hauv pem teb tswj hwm ntau ntau- qib traceability ntawm cov tshuaj da dej thiab cov khoom siv raw khoom kom ntseeg tau tias cov txiaj ntsig zoo sib xws ntawm kev ua haujlwm siab - ntom ntom.

    Kev Tswj Xyuas Zoo:ISO 9001: 2015, IATF 16949

    Environmental Compliance:ISO 14001, RoHS, REACH

    Product Certification:UL teev (E-cov ntaub ntawv muaj nyob ntawm qhov kev thov)

     

    Ntim & Xa

     

    Ntim:Lub tshuab nqus tsev- kaw los tiv thaiv- lub hnab zoo li qub uas muaj cov ntawv qhia desiccant thiab av noo, ntim rau hauv cov khoom siv ntxiv ob npaug - cov thawv ntawv phab ntsa corrugated. Moisture Barrier Bags (MBB) siv rau IPC/JEDEC J-STD-033 ua raws li cov laminates rhiab heev.


    Lub Sijhawm Lead:

    • Prototyping (10-16 txheej): 7 mus rau 10 hnub ua haujlwm.
    • Batch Production (10-32 txheej): 15 mus rau 25 hnub ua haujlwm.


    Logistics:Shipped ntawm huab cua freight los yog thoob ntiaj teb courier nrog traceable mus txog qhovtwg tooj.

     

    FAQ

     

    Q: Dab tsi yog qhov siab tshaj plaws ntawm txheej suav thiab nam piv koj tuaj yeem tsim kev ntseeg siab?

    A: Fabrication tuav txog li 40 txheej nrog qhov sib piv siab tshaj plaws ntawm 18: 1 rau los ntawm - qhov plating, thiab mus txog 3+N+3 cov qauv HDI.

    Q: Koj yuav ua li cas tiv thaiv board warping ntawm siab - txheej - suav panels nrog asymmetrical tooj liab faib?

    A: Engineering ua pawg- nce qhov sib npaug simulation ua ntej tsim khoom. Copper foil faib yog sib npaug ntawm cov txheej sab hauv, thiab symmetrical prepreg weaving styles raug tswj xyuas thaum lamination kom tsis txhob muaj kev ntxhov siab sab hauv.

    Q: Koj puas tuaj yeem tswj hwm tus qauv impedance raws li peb pawg-cov kev xav tau?

    A: Yog. Field solvers xam cov kab dav dav thiab qhov sib txawv ntawm cov dielectric qhov tsis tu ncua muab rau hauv cov ntaub ntawv cov ntaub ntawv, xa rov qab daim ntawv qhia impedance rau kev pom zoo ua ntej tsim cov yeeb yaj kiab.

    Q: Daim coupon xeem twg suav nrog cov siab - txheej - suav cov khoom xa tuaj?

    A: Kev xa khoom txheem suav nrog IPC-raws li kev ntsuas kev sib txuas kev ntxhov siab (IST) daim coupon lossis daim coupon microsection rau ib qho kev tsim khoom raws li kev thov.

    Q: Koj qhov tsawg kawg nkaus batch loj yog dab tsi rau kev cai siab - txheej - suav boards?

    A: Prototyping txiav txim pib ntawm 1 daim, nrog ntim ntau lawm scaling mus rau nruab nrab batches ib lub sij hawm tso tawm.

    Q: Cov ntaub ntawv dab tsi yuav tsum tau pib ua RFQ?

    A: Gerber RS-274X, ODB++ hom ntawv, nrog rau IPC netlist thiab cov ntaub ntawv qhia meej txog kev sib tw, kev xav tau impedance, thiab nto tiav.

     

    Thov ib daim Quote

     

    Xa Gerber lossis ODB++ cov ntaub ntawv nrog rau txheej suav, pawg thawj coj saib thickness, nto tiav, thiab kom muaj nuj nqis kom tau txais cov lus hais thiab DFM tshuaj xyuas hauv 24 teev.

    Cim npe nrov: high-txheej- suav multilayer pcb, Tuam Tshoj siab- txheej- suav multilayer pcb manufacturers, lwm tus neeg, Hoobkas

    Tug: Tsis muaj

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