2+N+2 HDI PCB

Lub 2+N+2 HDI PCB siv cov txheej txheem lamination ua ntu zus suav nrog ob txheej ntawm laser-drilled microvias ntawm ob sab saum toj thiab hauv qab ntawm lub hauv paus ntau- txheej txheej (N txheej). Cov qauv no muab cov kev sib txuas siab ceev thiab teeb liab kev ncaj ncees rau qhov chaw - txwv tsis pub, siab - zaus hluav taws xob sib dhos.

Fab muaj peev xwm txhawb nqa zoo - kab etching thiab staggered / stacked microvia configurations rau txoj kev ntom BGAs (pitch down mus rau 0.4 mm los yog qis dua) thaum tuav tswj impedance thiab structural kev ncaj ncees. Upload Gerber/ODB++ thiab pawg-up cov ntaub ntawv rau 24-teev DFM thiab impedance feasibility check.

 

 

Parameter	Specification Range
Stack -up Structure	2+N+2 HDI (Sequential Lamination)
Txheej suav (N Core)	2 mus rau 12 txheej (Customizable)
Min. Trace / Space (Kab / Dav)	2.5 hli / 2.5 hli (0.063 hli / 0.063 hli)
Min. Laser Laum Qhov Loj	3 mil (0.075 hli)
Min. Mechanical Qhov Loj	6 hli (0.15mm)
Ua tiav Board Thickness	0.8 hli - 3.2 hli
Impedance kam rau ua	+/- 10% (Standard), +/- 5% (Strict)
Aspect Ratio (MicroVia)	1:1
Aspect Ratio (Mechanical)	Mus txog 12: 1
Nto tiav	ENIG, Immersion Silver, OSP, ENEPIG, Hard Gold
Cov ntaub ntawv hauv paus	FR-4 (High-Tg >= 170 deg C), Isola (FR408HR, Astra MT77), Panasonic (Megtron 6/7)

 

 

Sequential Tsim-Technology:Enables laser microvias (<= 0.1 mm) on outer layers, freeing up internal routing channels for power and ground planes.

Ntawm -hauv-Pad Peev Xwm:Cov phaj tooj liab ncaj qha dhau ntawm cov microvias, txo cov kab mob parasitic inductance thiab txuag layout deg cheeb tsam nyob rau hauv zoo -pitch BGAs.

Tswj Impedance Performance:Precise dielectric thickness tswj thiab etching them ua tiav +/- 5% sib txawv impedance tswj rau siab -ceev sib txawv khub (PCIe Gen 4/5, Ethernet 100G).

Siab Thermal Reliability:Siv siab -Tg (170 deg C rau 210 deg C) laminates thiab tooj liab- ua cov khoom siv hluav taws xob, dhau IST (Interconnect Stress Testing) thiab thermal cycling ib IPC-TM-650.

 

 

 

Cov khoom siv Dielectric:Xaiv tau tus qauv FR4, qis- poob, lossis ultra- qis- poob laminates raws li cov teeb liab zaus thiab dielectric tas li (Dk<= 3.8, Df <= 0.004).

Copper Luj:txheej txheej 0.5 oz mus rau 2 oz; sab hauv txheej 0.5 oz mus rau 3 oz.

Solder Mask & Legend:Ntsuab, dub, xiav, liab, dawb, los yog daj kua photoimageable (LPI) daim npog qhov ncauj.

Kev xaiv kho qhov saum npoo:

• ENIG: 2 - 5 uin Au over 120 - 240 uin Ni.
• Immersion Silver: 8 - 15 uin.
• ENEPIG: Rau cov hlau sib txuas thiab ntau lub voj voog rov qab.

 

 

Kev tsim cov txheej txheem ua haujlwm raws li ISO 9001 thiab IATF 16949 cov lus qhia, txhawb nqa los ntawm kev ntsuas nruj nruj thiab cov txheej txheem xeem:

AOI (Tsis Siv Neeg Optical Inspection):100% kev tshuaj xyuas cov txheej txheem sab hauv thiab sab nrauv rau etch tsis xws luag, qhib, thiab luv.

X-Ray Inspection:Txheeb xyuas cov txheej txheem tseem ceeb - mus rau - txheej txheej thiab kev sau npe lamination.

Flying Probe & Fixture Testing:100% hluav taws xob txuas ntxiv thiab kev ntsuas kev sib cais (kuaj ntsuas hluav taws xob mus txog 250V).

Microsection Analysis:Kev tshuaj xyuas lub cev puas tsuaj (DPA) ntawm daim coupon ntau lawm los ntsuas cov ntaub qhwv tooj liab, ntawm lub thoob thickness, thiab dielectric qhov sib nrug.

TDR (Time Domain Reflectometry):Daim coupon{0}}raws li impedance pov thawj ua ntej khoom xa tuaj.

 

 

Kev tsim khoom:Cleanroom fabrication cog nruab nrog cov duab ncaj qha (DI) systems, siab -precision CO2 / UV laser drilling tshuab, lub tshuab nqus tsev lamination presses, thiab kab rov tav plating kab.

Cov ntawv pov thawj:

• ISO 9001: 2015 Kev Tswj Xyuas Zoo
• IATF 16949 Automotive Quality Management
• ISO 14001 Environmental Management System
• UL Certified (E-Cov ntaub ntawv sib piv IPC qauv)
• RoHS thiab REACH cov ntaub ntawv ua raws

 

 

Ntim:Lub tshuab nqus tsev- kaw los tiv thaiv- zoo li qub ESD hnab nrog cov khoom siv desiccant, cuam tshuam nrog kev poob siab- nqus npuas hauv ob lub- phab ntsa corrugated export cartons. Moisture-barrier bagging (MBB) thiab Humidity Indicator Cards (HIC) yog muab rau rhiab siab siab -frequency boards.

Logistics:Shipped ntawm huab cua freight (DHL, FedEx, UPS) los yog hiav txwv freight. Kev xa khoom txheem suav nrog tag nrho cov ntaub ntawv xa khoom, Daim Ntawv Pov Thawj Kev Ntsuam Xyuas (CoA), thiab cov ntawv ceeb toom microsection.

 

 

 

 

Upload koj cov ntaub ntawv Gerber, pawg- nce qhov yuav tsum tau ua, thiab ntim cov kwv yees kom tau txais kev tshuaj xyuas DFM thiab cov lus hais hauv 24 teev.

Cim npe nrov: 2+n+2 hdi pcb, Tuam Tshoj 2+n+2 hdi pcb manufacturers, lwm tus neeg, Hoobkas