Product Overview
Ceramic Circuit Boards yog siab- kev ntseeg tau hluav taws xob cov khoom siv hluav taws xob uas tsim los siv cov txheej txheem siab heev xws li tuab- zaj duab xis, nyias- zaj duab xis, Direct Plated Copper (DPC), Direct Bonded Copper (DBC), thiab Active Hlau Brazing (AMB), nrog siab -cov ntaub ntawv kev ua tau zoo, aluminium₃ oxide, aluminium oxide (Al Nitrate) silicon nitride (Si₃N₄) ua substrates.
Piv nrog cov tsoos FR4 PCBs lossis hlau-raws li substrates, Ceramic Circuit Boards muaj cov thermal conductivity siab heev, zoo hluav taws xob rwb thaiv tsev, thiab zoo heev - kub stability, ua kom ruaj khov nyob rau hauv huab cua txias.
Nyob rau hauv siab - zaus thiab kev sib txuas lus, 5G Base Station Ceramic PCB tau dhau los ua cov khoom tseem ceeb hauv lub tshuab hluav taws xob, RF modules, thiab siab - zog- cov khoom siv sib txuas lus ceev, tshwj xeeb tshaj yog tsim rau siab - zaus, siab - nrawm, thiab siab {{6}enios{2}.
Ceramic Circuit Boards tau siv dav hauv 5G kev sib txuas lus, hluav taws xob hluav taws xob, aerospace, automotive electronics, thiab high-end industrial equipment, ua rau lawv yog cov khoom siv tseem ceeb rau yav tom ntej - tiam siab - kev ntseeg siab hauv tshuab hluav taws xob.
Khoom nta
- Ultra{0}}siab thermal conductivity (txog 24–200 W/m·K+)
- Hluav taws xob rwb thaiv tsev zoo heev thiab tsis tshua muaj dielectric poob
- Tshwj xeeb siab - qhov kub thiab txias (ntev- lub sijhawm ua haujlwm siab tshaj 300 degree)
- Tsawg siab - zaus teeb liab poob, haum rau RF/microwave daim ntaub ntawv
- Tsawg thermal expansion coefficient, sib xws nrog chip ntim
- Zoo heev corrosion thiab aging kuj
- Txhawb kev tsim hluav taws xob siab ceev
- Haum rau huab cua ib puag ncig hluav taws xob tshuab
Cov cheeb tsam thov
5G Base Chaw nres tsheb RF Module
Fais fab Electronics
Aerospace & Defense Systems
Automotive Electronics / EV Fais Fab Modules
Siab -Frequency Communication Systems
High-Power LED Teeb pom kev zoo
Cov Khoom Siv Kho Mob Laser
Industrial High -Control Systems
Khoom Parameters (Piv txwv)
|
Yam khoom |
Specification |
|
Substrate |
Al₂O₃ / AlN / Si₃N₄ |
|
Txheej txheem |
DBC / DPC / Thick Film / Thin Film |
|
Board Thickness |
0.25-3.0 hli |
|
Min. Kab Dav/Spacing |
2/2 mil (siab- txheej txheem precision) |
|
Tooj Thickness |
0.5-10 oz |
|
Thermal conductivity |
24–200 W/m·K |
|
Dielectric tsis tu ncua |
6-9 (raws li cov khoom siv) |
|
Ua haujlwm kub |
-55℃~ 400 degree |
|
Nto tiav |
ENIG / Ni-Au / Ag / Cu plating |
Khoom zoo (Piv nrog FR4 PCB)
|
Yam khoom |
Ceramic Circuit Boards |
FR4 PCB |
|
Thermal conductivity |
⭐⭐⭐⭐⭐ |
⭐⭐ |
|
Siab -Qhov kub thiab txias |
⭐⭐⭐⭐⭐ |
⭐⭐ |
|
Siab -Frequency Performance |
⭐⭐⭐⭐⭐ |
⭐⭐⭐ |
|
Hluav taws xob rwb thaiv tsev |
⭐⭐⭐⭐⭐ |
⭐⭐⭐ |
|
Muaj peev xwm tuav tau |
⭐⭐⭐⭐⭐ |
⭐⭐⭐ |
|
Environmental Adaptability |
⭐⭐⭐⭐⭐ |
⭐⭐⭐ |
Summary of Advantages
- Muaj peev xwm ua kom sov siab heev rau siab - cov khoom siv fais fab
- Zoo heev - zaus ua haujlwm rau 5G thiab millimeter-wave daim ntawv thov
- Txhim kho qhov kev ntseeg siab thiab ua haujlwm ntev
- Haum rau qhov kub thiab txias, high voltage, thiab hnyav ib puag ncig
- Txhawb siab -ntau zog hluav taws xob tsim hluav taws xob
- Txo qhov kev pheej hmoo ntawm thermal tsis ua hauj lwm thiab txhim kho qhov system stability
- Ua tau raws li cov kev xav tau ntawm kev sib txuas lus siab heev thiab kev siv tshuab
Tom qab -Kev Muag Khoom & Kev Pabcuam
- DFM (Design for Manufacturability) txhawb nqa
- Kev xaiv cov khoom siv ceramic thiab cov lus qhia siv
- Thermal tswj thiab cua kub dissipation optimization txhawb
- RF/siab-frequency circuit design pab
- Prototyping sai sai thiab me me - cov kev pabcuam tsim khoom
- Kev ntsuam xyuas kev ntseeg siab thiab tsis ua hauj lwm tsom xam txhawb
- Kev xa khoom thoob ntiaj teb thiab kev txhawb nqa saw hlau
Cim npe nrov: Tuam Tshoj ceramic Circuit Court boards manufacturers, lwm tus neeg, Hoobkas
