PCBs yuav tsum ua raws li cov kev qhia tshwj xeeb uas tsim los ntawm IPC (Association Connecting Electronics Industries)-piv txwv li, IPC-6012 rau kev ua tau zoo ntawm pawg thawj coj saib xyuas thiab IPC-6013 rau cov qauv board hloov pauv tau- npog qhov tsis xws li cov khoom siv hluav taws xob, cov khoom siv hluav taws xob thiab cov khoom siv thermal. Piv txwv li, siab -PCBs zaus yuav tsum tau siv cov khoom siv qis- poob substrate (xws li Rogers 4350B) kom txo cov teeb liab attenuation, whereas automotive-qib PCBs yuav tsum dhau AEC-Q200 daim ntawv pov thawj kom ruaj khov ua haujlwm nyob rau hauv qhov kub ntawm -40℃rau 125 degree.
Cov theem tsim tsim yuav tsum tau siv EDA software (xws li Altium Designer lossis Cadence Allegro) los ua cov txheej txheem thiab cov txheej txheem, thaum tib lub sijhawm hais txog cov kev ntsuas tseem ceeb xws li Electromagnetic Compatibility (EMC) thiab impedance tswj (xws li, sib txawv khub impedance yuav tsum tswj tsis pub dhau 100Ω ± 10). Cov txheej txheem tsim khoom suav nrog cov kauj ruam xws li cov khoom txiav, drilling, electroless tooj liab plating, qauv hloov, etching, solder mask printing, thiab nto tiav (xws li, immersion kub los yog kub cua sov solder leveling); qhov tseem ceeb, siab - cov cuab yeej ua tau zoo (xws li Laser Direct Imaging -LDI-} tshuab) ua kom muaj peev xwm ua tiav nrog cov kab dav thiab qhov sib nrug zoo li 0.1 hli.
