Keeb kwm ntawm Printed Circuit Board Assembly

Xyoo 1941, Tebchaws Meskas tau siv tooj liab muab tshuaj txhuam rau hauv talc substrates los tsim cov xaim rau kev tsim cov fuses sib thooj.
Xyoo 1943, Tebchaws Meskas tau pib siv cov thev naus laus zis no ntau hauv cov khoom siv xov tooj cua tub rog.
Xyoo 1947, epoxy resin pib siv los tsim cov khoom siv substrate. Tib lub sijhawm, National Bureau of Standards (NBS) tau pib tshawb fawb txog kev tsim cov txheej txheem rau kev tsim cov khoom siv-xws li cov coils, capacitors, thiab resistors- siv tshuab luam ntawv Circuit Court.
Xyoo 1948, Tebchaws Meskas tau tso cai ua lag luam siv qhov kev tsim no.
Pib txij xyoo 1950, transistors- uas ua kom muaj cua sov tsawg heev - pib hloov cov raj nqus tsev loj; nws yog nyob rau ntawm no juncture uas luam Circuit Court board technology pib tau txais kev saws dav dav. Thaum lub sij hawm no, etching ntawm cov ntawv ci laminates tau tshwm sim raws li cov txheej txheem tsim khoom tseem ceeb.
Xyoo 1950, Nyiv pib siv cov xim nyiaj rau kev xaim ntawm cov iav substrates, nrog rau cov ntawv ci tooj liab rau kev xaim ntawm daim ntawv-raws li phenolic substrates (Copper-Clad Laminates, lossis CCLs) ua los ntawm phenolic resin.
Xyoo 1951, qhov tshwm sim ntawm polyimide resin cim qhov kev nce qib tseem ceeb hauv kev kub ntxhov ntawm cov khoom siv hauv qab, ua rau kev txhim kho tom ntej ntawm polyimide -raws li Circuit Court boards.
Xyoo 1953, Motorola tau tsim ob -ib tog luam tawm Circuit Board uas siv cov txheej txheem plated-los ntawm- qhov (PTH) txheej txheem. Txoj kev no tau siv tom qab siv rau kev tsim cov ntau- txheej Circuit Court boards.
Los ntawm xyoo 1960-ib xyoo caum tom qab lawv pib siv dav dav- luam tawm Circuit Board technologies tau mus txog theem ntawm kev loj hlob tuaj. Tom qab qhov kev taw qhia ntawm Motorola ob - sab laug boards, ntau- txheej luam ntawv Circuit Court boards pib tshwm sim, yog li txhim kho qhov sib piv ntawm cov xov hlau ceev rau substrate nto.
Xyoo 1960, V. Dahlgreen tau tsim thawj lub tshuab luam ntawv hloov tau yooj yim los ntawm kev kos ib daim ntawv hlau uas muaj cov qauv hauv Circuit Court rau hauv cov thermoplastic substrate.
Xyoo 1961, Hazeltine Corporation hauv Tebchaws Meskas tau tsim ntau- txheej txheej Circuit Court board los ntawm kev hloov cov plated- dhau ntawm - qhov txheej txheem.
Xyoo 1967, cov txheej txheem tsim khoom hu ua "Plated-up thev naus laus zis"-ib daim ntawv ntawm kev ua tiav- tau qhia.
Xyoo 1969, FD-R tau ua tiav cov khoom lag luam hloov pauv hloov pauv siv cov khoom siv polyimide.
Xyoo 1979, Pactel tau qhia txog "Pactel txheej txheem"- lwm txoj hauv kev tshiab hauv kev tsim khoom siv hluav taws xob ntxiv. Xyoo 1984, NTT tau tsim "Copper Polyimide Method" rau nyias - zaj duab xis circuits.
Xyoo 1988, Siemens tau tsim ib qho kev tsim- cov ntawv luam tawm Circuit Board rau Microwiring Substrates.
Xyoo 1990, IBM tau tsim "Surface Laminar Circuit" (SLC) tsim- cov ntawv luam tawm Circuit Board.
Xyoo 1995, Panasonic tau tsim lub ALIVH tsim- cov ntawv luam tawm Circuit Board.
Xyoo 1996, Toshiba tau tsim B2it tsim- cov ntawv luam tawm hluav taws xob.